Create and converge for value creation.
focuses on reconstruction of C-MOS Image Sensor (CIS) and manufacturing of Display Drive IC (DDI) COG based on Silicon Wafer Back grind & Saw Technology, and, with fingerprint recognition and System IC Wafer Back Grind & Saw response, it is driving the technological advancement of Wafer Back Grind / Saw / Recon./ COG unit processing while providing total solution for customer satisfaction. Also, it is looking forward to expanding its reach into the next-gen market by establishing Power Semiconductor Si & SiC Wafer Back-End Process and building Medical Packaging Lines.
(wafer backside grinding and polishing)
(uses diamond cutting blade to separate chips individually)
(the process of rearranging only good chips out of the separated chips)
(the process of auto-inspecting the outer surface of chips)
(marking defect chips with ink)
(assigning a unique number to the chip on the backside of each wafer)
(pre-forming of grooves in the cutting area for individual separation of chips)
(the process of placing the separated chips on the tray)
(the process of auto-inspecting the chips on the tray)